Semiconductors & Related Devices
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services. The company provides flip chip-scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages includes power management, transceivers, radar, and specialty silicon for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. Additionally, it offers micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
Discounted Cash Flow Valuation of Amkor Technology, Inc.
In the chart Earnings are multiplied by this value.
High margins render the company resilient under dire circumstances, hence able to drive competitors out or acquire them. ROE and ROA measure the average flow generated by each invested dollar. Their marginal value is a forecast of future growth, and it is considered by Buffett and Munger the most important single indicator.
The average Net Margin over the past 5 years is +6.68%.
The trend of Net Margin over the past 5 years is +1.41%.
The average ROA over the past 5 years is +9.1%.
The trend of ROA over the past 5 years is +1.31%.
The average ROE over the past 5 years is +14.17%.
The trend of ROE over the past 5 years is +2.26%.
Being debt the number one cause of investment losses and company death, the ratio Debt/FCF is of utmost importance to guarantee safety. On the other hand the Graham’s stability measures the drawdown of earnings, hence indicating the reliability of the flow generated by the company.
The Debt/FCF trailing twelve month is 2.71.
The trend of Debt/FCF over the past 5 years is -3.04.
Graham’s Stability measure stands at 0.66.
Growth can be dangerous when forecasting, simply projecting the current growth is in general wrong. A company passes through multiple phases, from being young and unprofitable, to the first periods of profitability and high growth, until it arrives at a period of regime with limited growth. Identifying in which phase the company is in may help forecasting.
The Revenue CAGR over the past 5 years is +11.01%.
The trend of Revenue growth rate over the past 5 years is +1.51%.
The Earnings CAGR over the past 5 years is +24.05%.
The trend of Earnings growth rate over the past 5 years is +5.9%.
The Equity CAGR over the past 5 years is +16.95%.
The trend of Equity growth rate over the past 5 years is +1.28%.
The FCF CAGR over the past 5 years is +23.12%.
The trend of FCF growth rate over the past 5 years is -7.81%.